ENEPIG Surface Finish
ENEPIG Surface Finish
Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) is an advanced and complicated surface finish. ENEPIG is similar to ENIG and was developed over a decade ago as a design improvement on the ENIG surface finish. ENEPIG recently became more popular due to a decrease in the price of palladium. The application process of ENEPIG is similar to the ENIG application process, with one extra step: the application of a palladium layer over the nickel layer, before adding the top gold layer. The palladium layer in the middle removes the possibility of “Black Pad”, caused by the nickel layer being corroded by the gold. The ENEPIG method forms a flat, coplanar, hard surface that is good for gold wire bonding, aluminum wire bonding, and provides excellent solder-ability.See below figure 1
Example of an ENEPIG Surface Finish
Pros
- Flat surfaces
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Strong
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Lead-free
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Good for PTH (Plated Through-holes)
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Long Shelf Life
Cons
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Expensive
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Not Re-workable
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Very Limited Availability
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Complicated Process (Three Parts)
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