large size PCB assembly
large size PCB assembly
SMT Processing Dimensions-Support PCB size as below:
Machine Type 1: Min. 50×50mm – Max. 810×490mm
Machine Type 2: Min. 50×50mm – Max. 900×600mm
Machine Type 3: Min. 45×45mm – Max. 450×1200mm
- SMT Production Capability
Machine Type 1: Min. 50×50mm – Max. 810×490mm
Machine Type 2: Min. 50×50mm – Max. 900×600mm
1.Mainly used for high-precision and high-complexity single boards,
2.Single board types: POP/ordinary boards/FPC/rigid-flex boards/metal substrates/ceramic substrates;
3.Minimum package that can be mounted: 03015 Chip/0.35 Pitch BGA;
4.Minimum component precision: ±0.04mm;
5.IC mounting precision: ±0.03mm;
6.PCB size: 50*50mm - 900*600mm;
7.PCB thickness: 0.5-6mm.
Machine Type 3: Min. 45×45mm – Max. 450×1200mm
1.Component Size: Passive Components: Mountable imperial 01005 (0.4mm * 0.2mm), 0201 BGA and other high-precision ICs
2.X-ray Inspection Support: Support X-ray inspection for BGA components with a minimum pitch of 0.25mm
3.Maximum Component Mounting Precision (100FP): 0.0375mm
4.Board Types: Rigid PCB (FR-4, Metal Substrate), Flexible PCB (FPC), Rigid-Flex PCB, Aluminum Substrate
5.Minimum PCB Size: 45mm X 45mm (Panelization required for sizes smaller than this)
6.Maximum PCB Size: 450mm X 1200mm
- SMT Production Capability
Machine Type 1: Min. 50×50mm – Max. 810×490mm
1.SMT Mountable Component Packages: 01005 to 2512; QFP, QFN, CSP, TSOP, SOJ, BGA, uBGA, etc.
2.Substrate Layers: 1~16 layers
3.Substrate Materials: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Substrate
4.Substrate Thickness: 0.2~7.0mm
5.Maximum Substrate Size: 810mm × 490mm
6.Copper Thickness: 0.5~4.0oz
7.Mounting Precision: Laser Recognition ±0.05mm, Image Recognition ±0.03mm
8.Component Height: 6mm (maximum)
9.Pin Pitch: Laser Recognition 0.65mm; High-Resolution VCS 0.2mm
10.Ball Pitch: Laser Recognition 1.0mm; High-Resolution VCS 0.25mm
11.BGA Ball Pitch: ≥0.25mm; BGA Ball Center Distance: ≥0.25mm; BGA Ball Diameter: ≥0.1mm; IC Pin Pitch: ≥0.2mm
Machine Type 2: Min. 50×50mm – Max. 900×600mm
1.Mainly used for high-precision and high-complexity single boards,
2.Single board types: POP/ordinary boards/FPC/rigid-flex boards/metal substrates/ceramic substrates;
3.Minimum package that can be mounted: 03015 Chip/0.35 Pitch BGA;
4.Minimum component precision: ±0.04mm;
5.IC mounting precision: ±0.03mm;
6.PCB size: 50*50mm - 900*600mm;
7.PCB thickness: 0.5-6mm.
Machine Type 3: Min. 45×45mm – Max. 450×1200mm
1.Component Size: Passive Components: Mountable imperial 01005 (0.4mm * 0.2mm), 0201 BGA and other high-precision ICs
2.X-ray Inspection Support: Support X-ray inspection for BGA components with a minimum pitch of 0.25mm
3.Maximum Component Mounting Precision (100FP): 0.0375mm
4.Board Types: Rigid PCB (FR-4, Metal Substrate), Flexible PCB (FPC), Rigid-Flex PCB, Aluminum Substrate
5.Minimum PCB Size: 45mm X 45mm (Panelization required for sizes smaller than this)
6.Maximum PCB Size: 450mm X 1200mm
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Add: 2F, BUILDING H, WANDA INDUSTRIAL ZONE, ZHOUSHI ROAD, LANGXIN COMMUNITY,SHIYAN STREET, BAO 'AN DISTRICT, SHENZHEN, GUANGDONG, CHINA
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