VIA IN PAD
PCB Assembly Guideline-VIA IN PAD
The Via in Pad technology proves to be a good technique to save real estate while making the layout of the PCB thus allowing denser boards with sticking to the standard technology Design Rule parameters.
By doing so one need to be aware of:
*Solder escape/wicking phenomena
*Tombstoning effects
*Use the via filling techniques as described here
Back to the technology data
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